Join DOOSAN Corporation Electro-Materials BG at DesignCon 2023!

Exhibitor Booth # 618 

About DOOSAN Corporation Electro-Materials BG:

"Essentials for Every Electronics" Doosan Electro-Materials is part of Doosan Group, which has the longest business history of 167 years in Korea. With our vision, we aim to become a world-class/high-end materials provider of every electronics and evolve to a component provider. At DesignCon 2023, we are showcasing Copper Clad Laminates (CCL) for High speed & high frequency and 5G mmWave antenna module for repeater and CPE. 

Use promo code SPECIAL to get free expo admission and 20% off all conference passes.

The Must Attend Event for Chip, Board, and Systems Design Engineers

DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.

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Three days of education, exhibits, and networking – technical paper sessions, tutorials, industry panels, product demos, expo hall and social functions.

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Attend the expertly curated, 14-track conference created by engineers for engineers, browse exhibits with hundreds of new products and technologies, and network with high-caliber industry professionals over the three-day event.

Expo

Take your expertise to the next level at Silicon Valley’s leading expo for chip, board, and systems design engineers. See the latest in high-speed design tools, technologies, and developments.

Conference

With 100+ sessions spanning 14 tracks, DesignCon’s conference program covers all aspects of electronic design, including signal & power integrity, high-speed link design, and machine learning.

Features

The Expo offers multiple free educational
and networking opportunities.
Attend keynote presentations by
visionaries, gain insights at Chiphead
Theater and watch live demos.