Join Kandou at DesignCon 2023!
Join Kandou at DesignCon 2023!
Exhibitor Booth # 418
About Kandou:
We are leaders in chip connectivity for various multi-billion dollar markets, including consumer, AI/ML, data centres, wireless base stations, and storage systems. Our solutions optimize performance and reduce power consumption for system manufacturers. From compute devices to satellites and high performance switch chips, our products power more than a million consumer and networking devices to date.
Use promo code SPECIAL to get free expo admission and 20% off all conference passes.
The Must Attend Event for Chip, Board, and Systems Design Engineers
DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.
Take Your Electronic Design Expertise to the Next Level at DesignCon
Three days of education, exhibits, and networking – technical paper sessions, tutorials, industry panels, product demos, expo hall and social functions.
A Systematic Approach to Learning & Discovery
Join fellow engineers at DesignCon and cover all aspects of electronic design.
Attend the expertly curated, 14-track conference created by engineers for engineers, browse exhibits with hundreds of new products and technologies, and network with high-caliber industry professionals over the three-day event.
Expo
Take your expertise to the next level at Silicon Valley’s leading expo for chip, board, and systems design engineers. See the latest in high-speed design tools, technologies, and developments.
Conference
With 100+ sessions spanning 14 tracks, DesignCon’s conference program covers all aspects of electronic design, including signal & power integrity, high-speed link design, and machine learning.
Features
The Expo offers multiple free educational
and networking opportunities.
Attend keynote presentations by
visionaries, gain insights at Chiphead
Theater and watch live demos.